These sockets with their unique design avoid cracking of solder joints and ceramic substrate:

LCC Image Sensors are packaged with up to 100 castellations (contacts). The ceramic substrate packaging presents new challenges for RoHS high temperature soldering. Utilisation of Andon’s unique LCC sockets eliminating the cracking of LCC Substrate and Solder Joints.Historically, Image Sensors are soldered directly on the printed circuit board (PCB). LCC Image Sensors require longer soldering times for RoHS high temperature solders. The ceramic substrate “expands” while the solder joint is “fixed” and cracks.

Key Benefits for Andon Electronics patented LCC Sockets:

  • Avoid colour array high temperature soldering damage.
  • Avoid electrostatic discharge (ESD) production line problems.
  • Avoid cleaning solutions clouding glass cover.

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